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Mar 22, 2010
 
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  Analyst offers peak into Intel 22nm litho roadmap (22 March 12:00)
Arete Research analyst at Jagadish Iyer said Intel's 22nm node will require 45 "litho layers," of which 55 percent will need immersion.
  Fab tool book-to-bill ratios go flat (22 March 12:00)
It appears the fab tool business is slightly cooling—or slowing—as the various book-to-bill ratios are flat.
  Novellus IBM launch 3D TSV program (22 March 12:00)
Novellus Systems and IBM Corp. are opening a joint development program to design a manufacturing-worthy, copper-based, 3D semiconductor through-silicon via (TSV) process.
  StarHub taps Huawei for mobile broadband upgrade (22 March 12:00)
StarHub and technology partner Huawei have concluded tests of HSPA+ network using Dual Carrier frequency technology to achieve a peak data downlink speed of up to 42.2Mbit/s.
  Toshiba focuses on LEDs drops incandescent lamps (22 March 12:00)
Planning to focus on LED lighting, Toshiba Corp. and Toshiba Lighting and Technology Corp. has stopped production of general-use incandescent bulbs
  Solar PV market hits 43GW record in 2009 (22 March 12:00)
Solar photovoltaic installations has achieved record high of 6.43GW in 2009—a 6 percent y-on-y growth, according to the latest Marketbuzz 2010 Report from Solarbuzz.
  IC forecasts What keeps analysts bullish worried (22 March 12:00)
Although the signs are positive in the chip sector this year, there are still some concerns. Here are 10 reasons to remain bullish—and worried—about 2010.
  Chip resistor trims down manufacturing costs (22 March 12:00)
Stackpole Electronics Inc. extends its convex termination chip resistor array product offering with the RAV052D that reduces manufacturing costs associated with placing a component.
  Image processor supports DVB-HT ATSC-MH (22 March 12:00)
From CogniVue Corp. comes the CV220X family of processors targeted for use in a broad range of automotive vision application systems, IP video surveillance and monitoring and mobile TV appli...
  DCDC converters come in ultracompact form (22 March 12:00)
XP Power has launched the ISF, ISG and ISL series of low-cost surface mount DC/DC converters that take up the minimum of board space allowing designers to reduce the size of their applicatio...
  LIN transceivers boast low wake-up management (22 March 12:00)
Atmel Corp. is rolling out new transceiver families for LIN automotive networking applications featuring the low power wake-up management for automotive body electronics applications.
  RF transceivers handle 470-510MHz short-range apps (22 March 12:00)
Micrel Inc. has released the latest member of its family of low-cost, low-power, 410 to 950MHz FSK RF transceivers.
  1612bit DACs pack internal reference SPI (22 March 12:00)
Linear Technology Corp. has introduced the LTC2654, a quad voltage output 16- and 12bit DAC family with internal reference and SPI interface.
  32nm secure processors enable fast encryption (22 March 12:00)
Intel Corp. has released a new line of secure processors implemented at 32nm and offering two new security features said to offer data centers a stronger foundation for cloud security.
  MicroUnity charges handset firms for infringement (19 March 12:00)
MicroUnity Systems Engineering has filed a suit March 16 alleging 22 handset companies including chip, system and service providers infringe 15 of its patents.
  Analog vendors struggle with crisis miscalculations (19 March 12:00)
The analog semiconductor market is in a state of uneasy balance between slightly lopsided and complete disarray, due to weak economy and miscalculations.
  Analyst iPhone should embrace Adobe Flash NFC (19 March 12:00)
MobileTrax LLC principal analyst prescribed Apple's iPhone a doze of Adobe Flash, microSD cards, multitasking and NFC, in an opinion piece sent out via email March 17.
  Qualcomm GreenRoad deliver driver-safety solution (19 March 12:00)
Qualcomm Inc. and GreenRoad will co-develop the first integrated solution that addresses mobile resource management (MRM), safety and driving behavior.
  China Sunergy expands via acquisitions (19 March 12:00)
China Sunergy Co. Ltd will acquire 100 percent of the shares of two related module manufacturers, CEEG Solar Science & Technology Co., Ltd and CEEG New Energy Co. Ltd.
  Zigbee Wi-Fi groups bring wireless nets to smart grid (19 March 12:00)
The Zigbee Alliance and the Wi-Fi Alliance announced are partnering to on wireless home area networks (HAN) for smart grid applications.
  MEMS mic market set for 35 growth this year (19 March 12:00)
The Information Network forecasts that MEMS microphones will reach 25.5 percent of the worldwide microphone market, as shipments increase 35 percent to nearly 500 million units.
  Geo-magnetic sensors propelling disruptive consumer apps (19 March 12:00)
The recent introduction of tiny, reliable and inexpensive MEMS gyroscopes and magnetometers, often integrated with MEMS accelerometers, makes enhanced motion tracking and more immersive user...
  Network processor boosts security content performance (19 March 12:00)
From Netronome comes the NFP-3240 network flow processor specifically designed to accelerate network, security and content performance up to 40 and 100Gbit/s.
  Wi-Fi antenna achieves up to 97 efficiency (19 March 12:00)
Dockon is offering a 2.4GHz antenna smaller than a dime that offers in simulations a 97 percent efficiency rating for a Wi-Fi system.
  18 brick power module suits 5V bus voltage apps (19 March 12:00)
Ericsson Power Modules is offering a 1/8 brick power module designed for 5V intermediate bus voltages and other applications requiring a tightly regulated 5V supply.
  LEDs come in warm- neutral-white color temps (19 March 12:00)
Cree Inc. has released the XLamp XP-G LED in warm- and neutral-white color temperatures (2600K to 5000K CCT).
  32Mbit mobile SDRAMs run up to 166MHz (19 March 12:00)
Integrated Silicon Solution Inc. is rolling out the latest members of its ultralow-power mobile SDRAM family that has an operating voltage of 1.8V, a maximum speed of 166MHz.
  MCUs promise high energy savings at low cost (19 March 12:00)
Infineon extends its XC800 microcontroller line with two new devices designed to further reduce system cost and improve energy efficiency in a wide range of industrial applications.
  10GbE switch delivers 720Gbits throughput (19 March 12:00)
Interface Masters Technologies has launched the Niagara 2924, a 24-port, 10GbE fully-managed switch designed for data centers, blade servers, carrier Ethernet and metro Ethernet devices
  Cyclone IV design guidelines (19 March 12:00)
This application note provides a set of guidelines and a list of factors to consider in Cyclone IV designs.
  DPRIO and multiple instances SDI application (19 March 12:00)
This application note discusses how the dynamic reconfiguration controller is used to control multiple instances of the Altera Serial Digital Interface MegaCore function.
  Automotive CE dip dragged MEMS market in 09 (18 March 12:00)
The MEMS chips market dipped 5 percent in 2009 according to Yole Developpement, which blamed the recession in automotive and consumer markets.
  DRAM shortage looms Semico warns (18 March 12:00)
Semico Research Corp. warns that shortages of DRAM memory chips are on the horizon and closing fast.
  Recognizing right power priority (18 March 12:00)
Everyone likes low power, and why not? But it is important to step back and ask why you favor low power, and the implications of going low power.
  Mentor ST co-develop 3220nm design solutions (18 March 12:00)
Mentor Graphics Corp. and STMicroelectronics have entered a broad-scoped collaboration to develop advanced design solutions at the 32nm technology node and down to 20nm node.
  Memsic opens Wuxi manufacturing RD center (18 March 12:00)
Memsic Inc. has completed the construction of its new manufacturing facility and R&D center in Wuxi, China.
  AUO plans to set up G75 LCD fab in China (18 March 12:00)
Taiwan's AU Optronics Corp. plans to establish a G7.5 TFT-LCD front-end manufacturing fab in Kunshan, Jiangsu.
  Home telehealth apps to boost CE revenues (18 March 12:00)
IMS Research forecasts that relatively strong growth in smart phones, portable media players, STBs, LCD TVs and refrigeration appliances will contribute to CE revenues of $406 billion this y...
  Hardware tool handles multicore debugging (18 March 12:00)
From Programmierbare Logik & Systeme (pls) comes the Universal Access Device 3+ (UAD3+) hardware tool for high-end trace, multicore and multitarget debugging.
  32bit secure processor tailored for smart cards (18 March 12:00)
ARM extends is smart card portfolio with a core based on the Cortex-M0. The 32bit SC000 is targeting the sector traditionally held by 8- and 16bit devices.
  Bipolar transistors save up to 60 board space (18 March 12:00)
Diodes Inc. is rolling out a dozen NPN and PNP transistors in its miniature PowerDI5 surface mount package that takes 47 percent less space than SOT223 and 60 percent less than DPAK.
  Camera interface IC enables safe driving (18 March 12:00)
Seiko Epson is shipping the S2D13P04 multi-camera analog interface IC that can combine images from multiple sides of the vehicle, helping to eliminate blind spots and enabling a safe driving...
  Integrated Ethernet switch cuts costs simplifies design (18 March 12:00)
Micrel Inc. has released the KSZ8873/KSZ8863 series of highly integrated three-port switch-on-a-chip ICs touted to provide the smallest footprint.
  Li-ion safety monitor controls six voltages two temp inputs (18 March 12:00)
Analog Devices Inc. has launched a Li-ion battery monitoring and protection system that integrates all necessary components, including voltage and current measurement, signal isolation and s...
  Duplexers improve handset sensitivity dynamic range (18 March 12:00)
Avago Technologies has launched three miniature high-performance duplexers for use in UMTS Bands 2, 4, and 8 handsets and data terminals.
  AM18xx pin multiplexing utility (18 March 12:00)
The AM18xx devices use a great deal of internal pin multiplexing to allow the most functionality in the smallest and lowest cost package.
  FEC decoding (18 March 12:00)
The application note aims to describe how one can implement the same FEC decoding in SW.
  Microfluids cool down 3D IC stacks (17 March 12:00)
IBM Researchers, in collaboration with two Swiss partners, seek to extend Moore's Law another 15 years using 3D stack architectures with liquid-cooling microchannels.
  Nanocomposites up Li-ion battery capacity 5x (17 March 12:00)
Nanocomposites target to scale up the capacity of Li-ion batteries 5x by hanging nanometer-sized silicon particles on trees of carbon black that self-assemble into porous micron-sized sphere...
  Putting the spotlight on solar power (17 March 12:00)
Tom Adams offers a closer look at four solar companies from the United States and Europe to see where they are now and where they may be heading.
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